{"bekendtgoerelseNoegle":{"noticeId":{"value":"0a646b33-68e6-4139-9a0c-af6045862a0e"},"noticeVersion":{"value":"01"},"noticePublicationNumber":{"value":"00701524-2026"}},"htmlDA":"\n\n \n 1 Køber1.1 KøberOfficielt navn: Danmarks Tekniske Universitet - DTU\n Køberens retlige status: Offentligretligt organ\n Den ordregivende myndigheds aktivitet: Uddannelse\n \n \n 2 Procedure2.1 ProcedureTitel: Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics\n Beskrivelse: DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides\n and nitrides of silicon to become its new primary instrument for 150 mm wafer processing.\n Delivery is expected no later than Q3 2027. The Instrument will be installed in the\n DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro-\n and nanofabrication tools. It serves a diverse community of over 200 active users,\n ranging from novice students to experienced researchers, as well a high percentage\n of commercial clients.
As an open access tool, the Instrument must support\n the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures\n defined by electron beam lithography to depths of several tens of microns. Meeting\n these demands requires exceptional process controllability and tunability: the system\n must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight\n sidewalls and minimal undercut for shallow features, alongside high etch rate deep\n etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics\n of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including\n Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all\n these masking materials.
The user interface must be intuitive and user friendly.\n The Instrument should be engineered to the highest industrial standards to minimize\n maintenance, and any required servicing must be straightforward and efficient.
The\n instrument must be configured for 150 mm wafer processing and a complete kit enabling\n the processing of 200 mm wafers must be included in the tender as an option. Furthermore,\n DTU will have the option to purchase one more ICP Reactive ion etcher for silicon\n dielctrics identical to the initial instrument.\n Identifikator for proceduren: 4cf047fd-3866-417b-83e5-e27ebe5bf445\n \n Udbudsprocedure: Offentligt udbud\n Proceduren er en hasteprocedure: nej\n 2.1.1 FormålKontraktens hovedformål: Varer\n Supplerende kontrakttype: Tjenesteydelser\n Primær klassifikation (cpv): 42000000 Industrimaskiner\n Supplerende klassifikation (cpv): 38636110 Lasere til industriel brug\n \n 2.1.2 UdførelsesstedPostadresse: Technical University of Denmark, NanoLab, Ørsted Plads, Building 346 \n \n \n Landsdel (NUTS): Københavns omegn (DK012)\n \n \n 2.1.4 Generelle oplysninger\n \n \n 2.1.6 UdelukkelsesgrundeKilder til grundlag for udelukkelse: code|name|document-used-in-public-procurement.epo-sub-espd\n \n \n \n 5 Delkontrakt5.1 Delkontrakt: LOT-0000Titel: Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics\n Beskrivelse: DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides\n and nitrides of silicon to become its new primary instrument for 150 mm wafer processing.\n Delivery is expected no later than Q3 2027. The Instrument will be installed in the\n DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro-\n and nanofabrication tools. It serves a diverse community of over 200 active users,\n ranging from novice students to experienced researchers, as well a high percentage\n of commercial clients.
As an open access tool, the Instrument must support\n the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures\n defined by electron beam lithography to depths of several tens of microns. Meeting\n these demands requires exceptional process controllability and tunability: the system\n must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight\n sidewalls and minimal undercut for shallow features, alongside high etch rate deep\n etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics\n of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including\n Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all\n these masking materials.
The user interface must be intuitive and user friendly.\n The Instrument should be engineered to the highest industrial standards to minimize\n maintenance, and any required servicing must be straightforward and efficient.
The\n instrument must be configured for 150 mm wafer processing and a complete kit enabling\n the processing of 200 mm wafers must be included in the tender as an option. Furthermore,\n DTU will have the option to purchase one more ICP Reactive ion etcher for silicon\n dielctrics identical to the initial instrument.\n \n 5.1.1 FormålKontraktens hovedformål: Varer\n Supplerende kontrakttype: Tjenesteydelser\n Primær klassifikation (cpv): 42000000 Industrimaskiner\n Supplerende klassifikation (cpv): 38636110 Lasere til industriel brug\n Valgmuligheder:Beskrivelse af optioner: There will be an option for an upgrade kit to 200 mm wafers for the instrument and\n an option for one further identical instrument.\n \n \n 5.1.2 UdførelsesstedPostadresse: Technical University of Denmark, NanoLab, Ørsted Plads, Building 346 \n \n \n Landsdel (NUTS): Københavns omegn (DK012)\n \n \n \n \n 5.1.6 Generelle oplysningerReserveret deltagelse: Deltagelse uden forbehold.\n Indkøbsprojekt, der ikke finansieres med EU-midler\n Udbuddet er omfattet af aftalen om offentlige udbud (GPA): ja\n Dette udbud er også egnet for små og mellemstore virksomheder (SMV'er): ja\n \n \n 5.1.9 UdvælgelseskriterierKilder til udvælgelseskriterier: code|name|document-used-in-public-procurement.epo-sub-espd\n \n 5.1.10 TildelingskriterierKriterium:\n \n Beskrivelse: The price for the instrument\n Kategori for tildelingskriteriet vægt: Vægtning (procentdel, præcis)Tildelingskriterium talværdi: 20\n \n \n Kriterium:\n Navn: Functionality and performance\n Beskrivelse: The functionality and performance of the tender, based on the tenderers response to\n appendix 1.\n Kategori for tildelingskriteriet vægt: Vægtning (procentdel, præcis)Tildelingskriterium talværdi: 50\n \n \n Kriterium:\n Navn: Quality of submitted samples\n Beskrivelse: The quality of submitted samples, as described in appendix 1\n Kategori for tildelingskriteriet vægt: Vægtning (procentdel, præcis)Tildelingskriterium talværdi: 30\n \n \n \n 5.1.11 TilbudsdokumenterSprog, som udbudsdokumenterne er officielt tilgængelige på: engelsk\n Frist for anmodning om yderligere oplysninger: 12-11-2026 22:55 +00:00\n Adresse på udbudsdokumenterne: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=459779&TID=200420246&B=\n \n 5.1.12 TilbudsvilkårVilkår for indgivelse:Elektronisk indgivelse: Påkrævet\n Indgivelsesadresse: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=459779&TID=200420246&B=\n Sprog, som tilbud og ansøgninger om deltagelse kan indgives på: engelsk\n Elektronisk katalog: Ikke tilladt\n Alternative tilbud: Ikke tilladt\n Tilbudsgivere kan indgive mere end ét tilbud: Ikke tilladt\n Beskrivelse af den finansielle garanti: If the supplier wishes pre-payment any such pre-payment will have to be backed by\n a bank guarantee. Please see draft contract.\n Frist for modtagelse af tilbud: 23-11-2026 22:55 +00:00\n Varighed, hvor tilbuddet skal forblive gyldigt: 6 Måned\n \n Betingelser for kontraktens udførelse:Udførelsen af kontrakten skal ske inden for rammerne af programmer for beskyttet beskæftigelse: Nej\n Der kræves en fortrolighedsaftale: nej\n Elektronisk fakturering: Påkrævet\n Der vil blive anvendt elektronisk bestilling: nej\n Der vil blive anvendt elektronisk betaling: ja\n \n \n 5.1.15 Teknikker\n Oplysninger om det dynamiske indkøbssystem:Intet dynamisk indkøbssystem\n \n \n 5.1.16 Yderligere oplysninger, mægling og gennemgangOrganisation med ansvar for klager: Klagenævnet for Udbud\n Oplysninger om klagefrister: Complaint regarding the award of a contract must be submitted no later than 45 calendar\n days from the date after the Contracting Authority has published a notice in the European\n Union Official Journal informing that the Contracting Authority has awarded/concluded\n a contract, cf. lov om Klagenævnet for Udbud (Complaints Board for Tenders) § 7, Section\n 2, no. 1.\n Organisation, der sikrer adgang til udbudsdokumenterne offline: Danmarks Tekniske Universitet - DTU\n Organisation, der leverer yderligere oplysninger om klageprocedurerne: Konkurrence- og Forbrugerstyrelsen\n Organisation, der modtager ansøgninger om deltagelse: Danmarks Tekniske Universitet - DTU\n Organisation, der behandler tilbud: Danmarks Tekniske Universitet - DTU\n \n \n \n 8 Organisationer8.1 ORG-0001Officielt navn: Danmarks Tekniske Universitet - DTU\n Registreringsnummer: 30060946\n Postadresse: Anker Engelunds Vej 1 \n \n \n Landsdel (NUTS): Københavns omegn (DK012)\n \n \n \n \n Internetadresse: https://www.dtu.dk\n Køberprofil: https://eu.eu-supply.com/ctm/company/companyinformation/index/165863\n Denne organisations roller:\n Organisation, der sikrer adgang til udbudsdokumenterne offline\n Organisation, der modtager ansøgninger om deltagelse\n Organisation, der behandler tilbud\n \n \n 8.1 ORG-0002Officielt navn: Klagenævnet for Udbud\n Registreringsnummer: 37795526\n Postadresse: Nævnenes hus, Toldboden 2 \n \n \n Landsdel (NUTS): Østjylland (DK042)\n \n \n \n Internetadresse: http://www.klfu.dk\n Denne organisations roller:Organisation med ansvar for klager\n \n \n 8.1 ORG-0003Officielt navn: Konkurrence- og Forbrugerstyrelsen\n Registreringsnummer: 10294819\n Postadresse: Carl Jacobsens Vej 35 \n \n \n Landsdel (NUTS): Byen København (DK011)\n \n \n \n Internetadresse: http://www.kfst.dk\n Denne organisations roller:Organisation, der leverer yderligere oplysninger om klageprocedurerne\n \n \n 8.1 ORG-0004Officielt navn: Mercell Holding ASA\n Registreringsnummer: 980921565\n Postadresse: Askekroken 11 \n \n \n Landsdel (NUTS): Oslo (NO081)\n \n \n E-mail: publication@mercell.com\n \n \n Internetadresse: http://mercell.com/\n Denne organisations roller:\n \n \n \n Oplysninger om bekendtgørelsenBekendtgørelsens ID: 0a646b33-68e6-4139-9a0c-af6045862a0e - 01\n Formulartype: Konkurrencevilkår\n Bekendtgørelsestype: Udbuds- eller koncessionsbekendtgørelse – standardordningen\n Afsendelsesdato for bekendtgørelsen: 08-10-2026 15:00 +00:00\n Dato for afsendelse af bekendtgørelsen (eSender): 08-10-2026 15:00 +00:00\n Bekendtgørelsens officielle sprog: engelsk \n Bekendtgørelsesnummer: 00701524-2026\n \n Offentliggørelsesdato: 12-10-2026\n \n \n","htmlEN":"\n\n \n 1 Buyer1.1 BuyerOfficial name: Danmarks Tekniske Universitet - DTU\n Legal type of the buyer: Body governed by public law\n Activity of the contracting authority: Education\n \n \n 2 Procedure2.1 ProcedureTitle: Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics\n Description: DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides\n and nitrides of silicon to become its new primary instrument for 150 mm wafer processing.\n Delivery is expected no later than Q3 2027. The Instrument will be installed in the\n DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro-\n and nanofabrication tools. It serves a diverse community of over 200 active users,\n ranging from novice students to experienced researchers, as well a high percentage\n of commercial clients.
As an open access tool, the Instrument must support\n the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures\n defined by electron beam lithography to depths of several tens of microns. Meeting\n these demands requires exceptional process controllability and tunability: the system\n must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight\n sidewalls and minimal undercut for shallow features, alongside high etch rate deep\n etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics\n of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including\n Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all\n these masking materials.
The user interface must be intuitive and user friendly.\n The Instrument should be engineered to the highest industrial standards to minimize\n maintenance, and any required servicing must be straightforward and efficient.
The\n instrument must be configured for 150 mm wafer processing and a complete kit enabling\n the processing of 200 mm wafers must be included in the tender as an option. Furthermore,\n DTU will have the option to purchase one more ICP Reactive ion etcher for silicon\n dielctrics identical to the initial instrument.\n Procedure identifier: 4cf047fd-3866-417b-83e5-e27ebe5bf445\n Internal identifier: 10527\n \n The procedure is accelerated: no\n 2.1.1 PurposeMain nature of the contract: Supplies\n Additional nature of the contract: Services\n Main classification (cpv): 42000000 Industrial machinery\n Additional classification (cpv): 38636110 Industrial lasers\n \n 2.1.2 Place of performancePostal address: Technical University of Denmark, NanoLab, Ørsted Plads, Building 346 \n \n \n Country subdivision (NUTS): Københavns omegn (DK012)\n \n \n 2.1.4 General information\n \n \n 2.1.6 Grounds for exclusionSources of grounds for exclusion: code|name|document-used-in-public-procurement.epo-sub-espd\n \n \n \n 5 Lot5.1 Lot: LOT-0000Title: Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics\n Description: DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides\n and nitrides of silicon to become its new primary instrument for 150 mm wafer processing.\n Delivery is expected no later than Q3 2027. The Instrument will be installed in the\n DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro-\n and nanofabrication tools. It serves a diverse community of over 200 active users,\n ranging from novice students to experienced researchers, as well a high percentage\n of commercial clients.
As an open access tool, the Instrument must support\n the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures\n defined by electron beam lithography to depths of several tens of microns. Meeting\n these demands requires exceptional process controllability and tunability: the system\n must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight\n sidewalls and minimal undercut for shallow features, alongside high etch rate deep\n etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics\n of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including\n Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all\n these masking materials.
The user interface must be intuitive and user friendly.\n The Instrument should be engineered to the highest industrial standards to minimize\n maintenance, and any required servicing must be straightforward and efficient.
The\n instrument must be configured for 150 mm wafer processing and a complete kit enabling\n the processing of 200 mm wafers must be included in the tender as an option. Furthermore,\n DTU will have the option to purchase one more ICP Reactive ion etcher for silicon\n dielctrics identical to the initial instrument.\n Internal identifier: 10527\n 5.1.1 PurposeMain nature of the contract: Supplies\n Additional nature of the contract: Services\n Main classification (cpv): 42000000 Industrial machinery\n Additional classification (cpv): 38636110 Industrial lasers\n Options:Description of the options: There will be an option for an upgrade kit to 200 mm wafers for the instrument and\n an option for one further identical instrument.\n \n \n 5.1.2 Place of performancePostal address: Technical University of Denmark, NanoLab, Ørsted Plads, Building 346 \n \n \n Country subdivision (NUTS): Københavns omegn (DK012)\n \n \n \n 5.1.3 Estimated duration\n \n 5.1.6 General informationReserved participation: Participation is not reserved.\n Procurement Project not financed with EU Funds.\n The procurement is covered by the Government Procurement Agreement (GPA): yes\n This procurement is also suitable for small and medium-sized enterprises (SMEs): yes\n \n 5.1.7 Strategic procurement\n 5.1.9 Selection criteriaSources of selection criteria: code|name|document-used-in-public-procurement.epo-sub-espd\n \n 5.1.10 Award criteriaCriterion:\n \n Description: The price for the instrument\n Category of award weight criterion: Weight (percentage, exact)Award criterion number: 20\n \n \n Criterion:\n Name: Functionality and performance\n Description: The functionality and performance of the tender, based on the tenderers response to\n appendix 1.\n Category of award weight criterion: Weight (percentage, exact)Award criterion number: 50\n \n \n Criterion:\n Name: Quality of submitted samples\n Description: The quality of submitted samples, as described in appendix 1\n Category of award weight criterion: Weight (percentage, exact)Award criterion number: 30\n \n \n \n 5.1.11 Procurement documentsLanguages in which the procurement documents are officially available: English\n Deadline for requesting additional information: 12-11-2026 22:55 +00:00\n Address of the procurement documents: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=459779&TID=200420246&B=\n \n 5.1.12 Terms of procurementTerms of submission:Electronic submission: Required\n Address for submission: https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=459779&TID=200420246&B=\n Languages in which tenders or requests to participate may be submitted: English\n Electronic catalogue: Not allowed\n \n Tenderers may submit more than one tender: Not allowed\n Description of the financial guarantee: If the supplier wishes pre-payment any such pre-payment will have to be backed by\n a bank guarantee. Please see draft contract.\n Deadline for receipt of tenders: 23-11-2026 22:55 +00:00\n Duration during which the tender must remain valid: 6 Month\n \n Terms of contract:The execution of the contract must be performed within the framework of sheltered employment programmes: No\n A non-disclosure agreement is required: no\n Electronic invoicing: Required\n Electronic ordering will be used: no\n Electronic payment will be used: yes\n \n \n 5.1.15 Techniques\n Information about the dynamic purchasing system:No dynamic purchase system\n \n \n 5.1.16 Further information, mediation and reviewReview organisation: Klagenævnet for Udbud\n Information about review deadlines: Complaint regarding the award of a contract must be submitted no later than 45 calendar\n days from the date after the Contracting Authority has published a notice in the European\n Union Official Journal informing that the Contracting Authority has awarded/concluded\n a contract, cf. lov om Klagenævnet for Udbud (Complaints Board for Tenders) § 7, Section\n 2, no. 1.\n Organisation providing offline access to the procurement documents: Danmarks Tekniske Universitet - DTU\n Organisation providing more information on the review procedures: Konkurrence- og Forbrugerstyrelsen\n Organisation receiving requests to participate: Danmarks Tekniske Universitet - DTU\n Organisation processing tenders: Danmarks Tekniske Universitet - DTU\n \n \n \n 8 Organisations8.1 ORG-0001Official name: Danmarks Tekniske Universitet - DTU\n Registration number: 30060946\n Postal address: Anker Engelunds Vej 1 \n \n \n Country subdivision (NUTS): Københavns omegn (DK012)\n \n Contact point: Mikkel Taanum\n \n \n Internet address: https://www.dtu.dk\n Buyer profile: https://eu.eu-supply.com/ctm/company/companyinformation/index/165863\n Roles of this organisation:\n Organisation providing offline access to the procurement documents\n Organisation receiving requests to participate\n Organisation processing tenders\n \n \n 8.1 ORG-0002Official name: Klagenævnet for Udbud\n Registration number: 37795526\n Postal address: Nævnenes hus, Toldboden 2 \n \n \n Country subdivision (NUTS): Østjylland (DK042)\n \n \n \n Internet address: http://www.klfu.dk\n Roles of this organisation:\n \n \n 8.1 ORG-0003Official name: Konkurrence- og Forbrugerstyrelsen\n Registration number: 10294819\n Postal address: Carl Jacobsens Vej 35 \n \n \n Country subdivision (NUTS): Byen København (DK011)\n \n \n \n Internet address: http://www.kfst.dk\n Roles of this organisation:Organisation providing more information on the review procedures\n \n \n 8.1 ORG-0004Official name: Mercell Holding ASA\n Registration number: 980921565\n Postal address: Askekroken 11 \n \n \n Country subdivision (NUTS): Oslo (NO081)\n \n \n Email: publication@mercell.com\n \n \n Internet address: http://mercell.com/\n Roles of this organisation:\n \n \n \n Notice informationNotice identifier/version: 0a646b33-68e6-4139-9a0c-af6045862a0e - 01\n \n Notice type: Contract or concession notice – standard regime\n Notice dispatch date: 08-10-2026 15:00 +00:00\n Notice dispatch date (eSender): 08-10-2026 15:00 +00:00\n Languages in which this notice is officially available: English \n Notice publication number: 00701524-2026\n OJ S issue number: 197/2026\n Publication date: 12-10-2026\n \n \n","opsummeringDA":{"card":{"titel":"Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics","ordregiver":"Danmarks Tekniske Universitet - DTU","ordregiverId":"30060946","ordregiverIdDatavasket":"30060946","publiceringsdato":"2026-10-12+02:00","cpvKode":"42000000","cpvTitel":"Industrimaskiner","formulartype":"Konkurrencevilkår","formulartypeKode":"competition","tidsfrister":["2026-11-23T22:55:00Z"],"alleOrdregivere":["Danmarks Tekniske Universitet - DTU"],"beskrivelse":"DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides and nitrides of silicon to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q3 2027. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a high percentage of commercial clients.\n\nAs an open access tool, the Instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures defined by electron beam lithography to depths of several tens of microns. Meeting these demands requires exceptional process controllability and tunability: the system must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight sidewalls and minimal undercut for shallow features, alongside high etch rate deep etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all these masking materials.\n\nThe user interface must be intuitive and user friendly. The Instrument should be engineered to the highest industrial standards to minimize maintenance, and any required servicing must be straightforward and efficient.\n\nThe instrument must be configured for 150 mm wafer processing and a complete kit enabling the processing of 200 mm wafers must be included in the tender as an option. Furthermore, DTU will have the option to purchase one more ICP Reactive ion etcher for silicon dielctrics identical to the initial instrument.","bkSubTypeKode":"16","bkSubType":"Udbudsbekendtgørelse – det generelle direktiv, standardordningen","erAendring":false},"indholdsType":"HENTET_FRA_TED","sekundaereOrdregivere":[],"udforelsesstedNutsCode":["DK012"],"udforelsesstedSubLand":["Københavns omegn"],"udforelsesstedLand":["Danmark"],"udforelsesstedBy":["Kgs. Lyngby"],"tilbudsfrister":["2026-11-23T22:55:00Z"],"intressentfrister":[],"deltagelsefrister":[],"svarfrister":[],"antalParts":0,"antalLots":1,"udbudsDokumenter":["https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=459779&TID=200420246&B="]},"opsummeringEN":{"card":{"titel":"Delivery and installation of a ICP Reactive ion etcher for silicon dielctrics","ordregiver":"Danmarks Tekniske Universitet - DTU","ordregiverId":"30060946","ordregiverIdDatavasket":"30060946","publiceringsdato":"2026-10-12+02:00","cpvKode":"42000000","cpvTitel":"Industrial machinery","formulartype":"Competition","formulartypeKode":"competition","tidsfrister":["2026-11-23T22:55:00Z"],"alleOrdregivere":["Danmarks Tekniske Universitet - DTU"],"beskrivelse":"DTU Nanolab wishes to acquire a high ion density source reactive ion etcher for oxides and nitrides of silicon to become its new primary instrument for 150 mm wafer processing. Delivery is expected no later than Q3 2027. The Instrument will be installed in the DTU Nanolab cleanroom - a university facility providing a comprehensive suite of micro- and nanofabrication tools. It serves a diverse community of over 200 active users, ranging from novice students to experienced researchers, as well a high percentage of commercial clients.\n\nAs an open access tool, the Instrument must support the full spectrum of etching of silicon-based dielectrics, from sub 100 nm nanostructures defined by electron beam lithography to depths of several tens of microns. Meeting these demands requires exceptional process controllability and tunability: the system must perform ultra precise, low-rate etches (< 100 nm/min) with smooth and straight sidewalls and minimal undercut for shallow features, alongside high etch rate deep etches (approaching 500 nm/min). It must also accommodate all silicon dielectrics of the form SixNy, SixOx and SixOyNz, and be compatible with mask materials including Si, Cr, e-beam resists and UV/DUV photoresists with high mask selectivity for all these masking materials.\n\nThe user interface must be intuitive and user friendly. The Instrument should be engineered to the highest industrial standards to minimize maintenance, and any required servicing must be straightforward and efficient.\n\nThe instrument must be configured for 150 mm wafer processing and a complete kit enabling the processing of 200 mm wafers must be included in the tender as an option. Furthermore, DTU will have the option to purchase one more ICP Reactive ion etcher for silicon dielctrics identical to the initial instrument.","bkSubTypeKode":"16","bkSubType":"Contract notice – general directive, standard regime","erAendring":false},"indholdsType":"HENTET_FRA_TED","sekundaereOrdregivere":[],"udforelsesstedNutsCode":["DK012"],"udforelsesstedSubLand":["Københavns omegn"],"udforelsesstedLand":["Denmark"],"udforelsesstedBy":["Kgs. Lyngby"],"tilbudsfrister":["2026-11-23T22:55:00Z"],"intressentfrister":[],"deltagelsefrister":[],"svarfrister":[],"antalParts":0,"antalLots":1,"udbudsDokumenter":["https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=459779&TID=200420246&B="]}}