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8978 - Purchase of Wire Bonder

DTU requires a wire bonder to serve our users from university and commercial companies.
It should be able to make wire bonding on chips to substrates of both R&D type to low volume production.
This means a high variety of chip, bond pad and substrate designs and materials.
Because of the many users, ease of operation is important for us.

Åbn udbudsdetaljer (gældende version 07-06-2024) Luk udbudsdetaljer (gældende version 07-06-2024)
Titel 8978 - Purchase of Wire Bonder
Dokumenttype Varer og tjenesteydelser med klar grænseoverskridende interesse
Opgavebeskrivelse DTU requires a wire bonder to serve our users from university and commercial companies.
It should be able to make wire bonding on chips to substrates of both R&D type to low volume production.
This means a high variety of chip, bond pad and substrate designs and materials.
Because of the many users, ease of operation is important for us.
Annonceret 07-06-2024 kl. 14.00
Deadline 09-07-2024 kl. 12.00
Udbudstype Udbud under tærskelværdierne
Opgavetype Varekøb
Tildelingskriterier Bedste forhold mellem pris og kvalitet
Link til udbudsmateriale http://eu.eu-supply.com/ctm/Supplier/PublicPurchase/405566
Ordregiver Danmarks Tekniske Universitet - DTU
Adresse Anker Engelunds Vej 1
2800
Kgs. Lyngby
CPV kode 38000000-5 - Laboratorieudstyr, optisk udstyr og præcisionsudstyr (ikke briller)
Udbudsform Andet
Kontaktperson Pia Blume
Kontakt E-mail: piabl@dtu.dk
Telefon: +45 93511388